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Audfly to Showcase The Acoustic Layer at Intel Connection 2026
Sep. 10, 2026
Audfly will participate as a Gold Sponsor at Intel Connection 2026, taking place in Suzhou, China, on September 22–23.

At the center of the 15,000-square-meter exhibition area, Audfly will present an immersive acoustic experience space themed “The Next-Generation Interface for AI PCs.” The showcase will explore how sound can evolve from a content output into an intelligent interaction layer for AI PCs.


Audfly to Showcase The Acoustic Layer at Intel Connection 2026


As AI PCs become more capable of understanding users and responding proactively, Audfly believes sound will play a central role in creating more natural, intuitive interactions. This vision is embodied in The Acoustic Layer—a full-stack acoustic capability that connects environmental awareness, scenario understanding, and precise sound delivery.

At the event, Audfly will demonstrate its “Perception + Execution” approach:

Perception: helping devices identify important sounds in complex environments

Execution: delivering sound precisely to the intended listener

Experience: enabling more immersive and natural AI interactions

Security: supporting voice privacy and confidential meeting scenarios

Audfly will also join the event’s academic forums to discuss the future of AI interaction and the role of advanced acoustic technologies in intelligent devices.

Visit Audfly at Intel Connection 2026 to experience The Acoustic Layer—the next-generation interface for AI PCs.
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